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FGA120N30D 300V PDP IGBT June 2006 FGA120N30D 300V PDP IGBT Features * High Current Capability * Low saturation voltage: VCE(sat), Typ = 1.1V@ IC = 25A * High Input Impedance Description Employing Unified IGBT Technology, FGA120N30D provides low conduction and switching loss. FGA120N30D offers the optimum solution for PDP applications where low condution loss is essential. C G TO-3P GCE E TC = 25C unless otherwise noted Absolute Maximum Ratings Symbol VCES VGES IC ICM IF IFM PD TJ Tstg TL Notes: Description Collector-Emitter Voltage Gate-Emitter Voltage Collector Current Pulsed Collector Current (Note 1) FGA120N30D 300 30 @ TC = 25C @ TC = 25C @ TC = 100C @ TC = 25C @ TC = 100C 120 300 10 40 290 116 -55 to +150 -55 to +150 300 Units V V A A A A W W C C C Diode Continuous Forward Current Diode Maximum Forward Current Maximum Power Dissipation Maximum Power Dissipation Operating Junction Temperature Storage Temperature Range Maximum Lead Temp. for soldering Purposes, 1/8" from case for 5 seconds (1) Repetitive test , pulse width = 100usec , Duty = 0.5 * Ic_pulse limited by max Tj Thermal Characteristics Symbol RJC(IGBT) RJC(DIODE) RJA Parameter Thermal Resistance, Junction-to-Case for IGBT Thermal Resistance, Junction-to-Case for Diode Thermal Resistance, Junction-to-Ambient Typ. ---- Max. 0.43 1.56 40 Units C/W C/W C/W (c)2006 Fairchild Semiconductor Corporation 1 www.fairchildsemi.com FGA120N30D Rev. A FGA120N30D 300V PDP IGBT Package Marking and Ordering Information Device Marking FGA120N30D Device FGA120N30D Package TO-3P Reel Size -- Tape Width -- Quantity 30 Electrical Characteristics of the IGBT Symbol Off Characteristics BVCES BVCES/ TJ ICES IGES Collector-Emitter Breakdown Voltage Temperature Coefficient of Breakdown Voltage Collector Cut-Off Current G-E Leakage Current TC = 25C unless otherwise noted Parameter Test Conditions Min. Typ. Max. Units VGE = 0V, IC = 250A VGE = 0V, IC = 250A VCE = VCES, VGE = 0V VGE = VGES, VCE = 0V 300 ---- -0.6 --- --100 250 V V/C A nA On Characteristics VGE(th) G-E Threshold Voltage IC = 250uA, VCE = VGE IC = 25A, VGE = 15V VCE(sat) Collector to Emitter Saturation Voltage IC = 120A, VGE = 15V IC = 120A, VGE = 15V, TC = 125C 2.5 ---4.0 1.1 1.9 2.0 5.0 1.4 --V V V V Dynamic Characteristics Cies Coes Cres Input Capacitance Output Capacitance Reverse Transfer Capacitance VCE = 30V, VGE = 0V, f = 1MHz ---2310 360 100 pF pF pF Switching Characteristics td(on) tr td(off) tf Eon Eoff Ets td(on) tr td(off) tf Eon Eoff Ets Qg Qge Qgc Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Turn-On Switching Loss Turn-Off Switching Loss Total Switching Loss Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Turn-On Switching Loss Turn-Off Switching Loss Total Switching Loss Total Gate Charge Gate-Emitter Charge Gate-Collector Charge VCE = 200V, IC = 25A, VGE = 15V VCC = 200V, IC = 25A, RG = 8.7, VGE = 15V, Resistive Load, TC = 125C VCC = 200V, IC = 25A, RG = 8.7, VGE = 15V, Resistive Load, TC = 25C -----------------30 270 100 130 0.17 0.56 0.73 30 280 105 180 0.18 0.9 1.08 120 15 60 ---300 ----------180 22 90 ns ns ns ns mJ mJ mJ ns ns ns ns mJ mJ mJ nC nC nC 2 FGA120N30D Rev. A www.fairchildsemi.com FGA120N30D 300V PDP IGBT Electrical Characteristics of DIODE T Symbol VFM trr Irr Qrr C = 25C unless otherwise noted Parameter Diode Forward Voltage IF = 10A Test Conditions TC = 25C TC = 125C TC = 25C TC = 125C TC = 25C TC = 125C TC = 25C TC = 125C Min. --------- Typ. 1.1 0.9 21 35 2.8 5.6 29.4 98 Max. 1.4 -------- Units V Diode Reverse Recovery Time IF = 10A dI/dt = 200A/s ns Diode Peak Reverse Recovery Current Diode Reverse Recovery Charge A nC 3 FGA120N30D Rev. A www.fairchildsemi.com FGA120N30D 300V PDP IGBT Typical Performance Characteristics Figure 1. Typical Output Characteristics 180 T C = 25 C 150 20V 150 o Figure 2. Typical Output Characteristics 180 T C = 125 C 20V 15V 120 10V o 12V Collector Current, IC [A] 15V 120 12V 10V Collector Current, IC [A] 90 90 V G E =8V 60 V G E =8V 30 60 30 0 0 2 4 6 0 0 2 4 6 Collector-Em itter Voltage, V CE [V] C ollector-E m itter V oltage, V C E [V ] Figure3. Typical Saturation Voltage Characteristics 150 C o m m o n E m itte r V GE = 15V Figure 4. Transfer characteristics 200 100 C o m m o n E m itte r V CE = 2 0V TC = 25 C o o Collector Current, IC [A] 120 TC = 125 C 90 o Ic , Collector Current [A] TC = 25 C o T C = 125 C 10 60 30 0 0 .0 0 .5 1 .0 1 .5 2 .0 2 .5 3 .0 1 0 2 4 6 8 10 C o llecto r-E m itte r V o lta g e , V C E [V ] V C E , G a te T o E m itte r V o lta g e [V ] Figure 5. Saturation Voltage vs. Case Temperature at Variant Current Level Figure 6. Saturation Voltage vs. VGE 2 .4 6 Collector-Emitter Voltage, VCE [V] C o m m o n E m itte r V GE = 15V 2 .0 12 0 A CE C o m m o n E m it t e r o TC = 25 C Collector - Emitter Voltage, V [V] 5 4 1 .6 50A 1 .2 25A 3 120A 2 50A 25A 1 1 2 .5 A 0 .8 I C = 1 2.5 A 0 .4 25 50 75 o 0 100 125 4 8 12 16 20 C ase Te m pera ture , T C [ C ] G a t e - E m it t e r V o lt a g e , V G E [ V ] 4 FGA120N30D Rev. A www.fairchildsemi.com FGA120N30D 300V PDP IGBT Typical Performance Characteristics Figure 7. Saturation Voltage vs. VGE 6 C o m m o n E m itte r o TC = 125 C (Continued) Figure 8. Capacitance Charaacteristics 5000 C ies 4000 C om m on E m itter V G E = 0V , f = 1M H z T C = 25 C C oes 3000 o CE [V] 5 Collector - Emitter Voltage, V 4 3 120A Capacitance [pF] 2000 C res 2 25A 1 1 2 .5 A 0 4 8 50A 1000 0 12 16 20 0.1 1 10 30 G a t e - E m it te r V o lta g e , V G E [V ] C ollector-Em itter V oltage, V C E [V ] Figure 9. Gate Charge Characteristics Figure 10. SOA Characteristics 14 C om m on E m itter RL = 8 T C = 25 C o 1000 Ic M A X (P ulsed) 50s Ic M A X (C ontinuous) 100 1m s D C O peration 10 100s Gate-Emitter Voltage, VGE [V] 12 10 8 6 4 2 0 0 V cc = 200V Collector Current, Ic [A] 1 S ingle N onrepetitive o P ulse Tc = 25 C C urves m ust be derated linearly w ith increase in tem perature 0.1 1 10 100 1000 0.1 30 60 90 120 150 G a te C h a rg e, Q g [n C ] C ollector - E m itter V o ltage, V C E [V ] Figure 11. Turn-On Characteristics vs. Gate Resistance 1000 Figure 12. Turn-Off Characteristics vs. Gate Resistance 10 00 tr td (off) Switching Time [ns] 100 td(on) C om m on Em itter V C C = 200V, V G E = 15V I C = 25A T C = 25 C T C = 125 C o o Switching Time [ns] tf 1 00 C o m m o n E m itte r V C C = 2 00 V , V G E = 15 V I C = 25A T C = 25 C 10 T C = 12 5 C 0 10 20 30 40 50 o o 10 0 10 20 30 40 50 Gate R esistance, R G [ ] G a te R e sista nce, R G [ ] 5 FGA120N30D Rev. A www.fairchildsemi.com FGA120N30D 300V PDP IGBT Typical Performance Characteristics Figure 13. Turn-On Characteristics vs. Collector Current C om m on E m itter V CC = 200V, V GE = 15V R G = 8.7 T C = 25 C T C = 125 C o o (Continued) Figure 14.Turn-Off Characteristics vs. Collector Current 1000 1000 tr Switching Time [ns] Switching Time [ns] tf 100 td(off) 100 td(on) C om m on Em itter V C C = 200V,V G E = 15V R G =8.7 T C = 25 C o 10 0 20 40 60 80 100 120 10 0 20 40 60 T C = 125 C 80 100 120 o C ollector C urrent, I C [A ] C ollector C urrent, I C [A ] Figure 15. Switching Loss vs. Gate Resistance Figure 16. Switching Loss vs. Collector Current C om m on E m itter V C C = 200V , V G E = 15V I D = 25A T C = 25 C o 10 C om m on E m itter V C C = 200V ,V G E = 15V R G = 5 T C = 25 C o E off Switching Loss [mJ] 1 Switching Loss [mJ] T C = 125 C o E off T C = 125 C o E on 1 E on 0.1 0 10 20 30 40 50 0.1 0 20 40 60 80 100 120 G a te R e sista n ce , R G [ ] C o lle cto r C urre n t, I C [A ] Figure 17. Turn-Off SOA Figure 1000 Safe O perating Area o V GE = 20V, T C = 100 C Collector Current, IC [A] 100 10 1 10 100 1000 Collector-Emitter Voltage, V C E [V] 6 FGA120N30D Rev. A www.fairchildsemi.com FGA120N30D 300V PDP IGBT Typical Performance Characteristics (Continued) Figure 18. Transient Thermal Impedance of IGBT 1 Thermal Response [Zthjc] 0.5 0.1 0.2 0.1 0.05 0.01 Pdm 0.02 0.01 single pulse t1 t2 Duty factor D = t1 / t2 Peak Tj = Pdm x Zthjc + TC 1E-3 1E-5 1E-4 1E-3 0.01 0.1 1 10 Rectangular Pulse Duration [sec] Figure 19. Forward Characteristics Figure 20. Typical Reverse Recovery Current 5 I F = 10A Reverse Recovery Current , Irr [A] 100 T J = 125 C o Forward Current , IF [A] 4 T C = 25 C o 10 T J = 25 C o 3 2 1 1 T C = 25 C 0.1 0.0 0.5 1.0 1.5 T C = 125 C 2.0 2.5 o o 0 100 di/dt [A/s] 500 Forw ard Voltage , V F [V] Figure 21. Typical Reverse Recovery Time 36 IF = 10A Reverse Recovery Time , trr [ns] Tc = 25 C 32 o 28 24 100 di/dt [A/s] 500 7 FGA120N30D Rev. A www.fairchildsemi.com FGA120N30D 300V PDP IGBT Mechanical Dimensions TO-3P 15.60 0.20 3.80 0.20 13.60 0.20 o3.20 0.10 9.60 0.20 4.80 0.20 1.50 -0.05 +0.15 12.76 0.20 19.90 0.20 16.50 0.30 3.00 0.20 1.00 0.20 3.50 0.20 2.00 0.20 13.90 0.20 23.40 0.20 18.70 0.20 1.40 0.20 5.45TYP [5.45 0.30] 5.45TYP [5.45 0.30] 0.60 -0.05 +0.15 8 FGA120N30D Rev. A www.fairchildsemi.com FGA120N30D 300V PDP IGBT TRADEMARKS The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks. ACExTM FAST(R) ActiveArrayTM FASTrTM BottomlessTM FPSTM Build it NowTM FRFETTM CoolFETTM GlobalOptoisolatorTM CROSSVOLTTM GTOTM DOMETM HiSeCTM EcoSPARKTM I2CTM 2 E CMOSTM i-LoTM ImpliedDisconnectTM EnSignaTM IntelliMAXTM FACTTM FACT Quiet SeriesTM Across the board. Around the world.TM The Power Franchise(R) Programmable Active DroopTM ISOPLANARTM LittleFETTM MICROCOUPLERTM MicroFETTM MicroPakTM MICROWIRETM MSXTM MSXProTM OCXTM OCXProTM OPTOLOGIC(R) OPTOPLANARTM PACMANTM POPTM Power247TM PowerEdgeTM PowerSaverTM PowerTrench(R) QFET(R) QSTM QT OptoelectronicsTM Quiet SeriesTM RapidConfigureTM RapidConnectTM mSerDesTM ScalarPumpTM SILENT SWITCHER(R) SMART STARTTM SPMTM StealthTM SuperFETTM SuperSOTTM-3 SuperSOTTM-6 SuperSOTTM-8 SyncFETTM TCMTM TinyLogic(R) TINYOPTOTM TruTranslationTM UHCTM UniFETTM UltraFET(R) VCXTM WireTM DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD'S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN, WHICH COVERS THESE PRODUCTS. LIFE SUPPORT POLICY FAIRCHILD'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 2. A critical component is any component of a life support device 1. Life support devices or systems are devices or systems which, or system whose failure to perform can be reasonably expected (a) are intended for surgical implant into the body, or (b) support to cause the failure of the life support device or system, or to or sustain life, or (c) whose failure to perform when properly used affect its safety or effectiveness. in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Advance Information Product Status Formative or In Design First Production Definition This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only. Rev. I19 Preliminary No Identification Needed Full Production Obsolete Not In Production 9 FGA120N30D Rev. A www.fairchildsemi.com |
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